In Win IW-BK623.BN300TBL Fiche technique télécharger pdf

Design Philosophy

To design a small 12.5L SFF chassis with better thermal & acoustic

performance than other bigger size chassis.

Tool Free

Optional screwless designs-ODD/FDD/HDD bays and top cover.

3rd Generation of Partition Plate Cooling Technology (PPCT)

PPCT is the world's first advanced thermal and acoustic cooling

technology, which provides S.F.F. chassis with excellent thermal solutions

while creating a quieter computing experience. PPCT does not require

second fan; yet still provides an excellent thermal solution. The 3rd

generation of PPCT includes an adjustable air duct for various CPU fans

and efficiently eliminates overheat while enhances airflow of entire system.

The new PPCT also supports the LGA1156 socket.

Cooling Technology also supports the LGA1156 socket.

Easy Integration

Compatible with all standard desktop components.

Easy system integration.

Flexible Compatibility

Small but flexible enough to accommodate four full height PCI cards.

BK623

mATX Chassis

CASE SIZE

PROCESSOR

EXTERNAL DRIVE BAY

INTERNAL DRIVE BAY

FRONT PORTS

DIMENSIONS (HxWxD)

w/o Front Panel

M/B

I/O EXPANSION SLOTS

POWER SUPPLY

THERMAL SOLUTION

SAFETY

SECURITY

OPTIONAL

S.F.F Tiny Tower Chassis

Support Dual Core and Quad Core Processor

5.25" x 1, 3.5" x1

3.5" x 1

USB 2.0 x 4, HD Audio

12.7" x 5.5" x 10.8"

323 x 140 x 276 mm (12.5L)

Micro ATX

Full Height Slots x 4

SFX 12V Form Factor, 300W

Intel Mt. Jade Ref. Design / Removable Air Filter

New Partition Plate Cooling Technology (New PPCT)

No 2

Fan (Rear Fan) Needed

Meets RoHS, CE and FCC Class B Requirements

Padlock Loop / Kensington Slot

IEEE 1394 / IR / Chassis Intrusion Switch

Tool-Free ODD/FDD/ HDD Bay Clips

Tool-Free Side Panel Clips

Using Partition Plate Cooling Tech

BK Series uses Intel Mt. Jade as Ref. Design

* Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the

United States and other countries.

*The actual product is subject to change without prior notice. In Win Development Inc.

reserves the right to make nal modications.

BK623

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Page 1 - Flexible Compatibility

Design PhilosophyTo design a small 12.5L SFF chassis with better thermal & acoustic performance than other bigger size chassis.Tool Free Optional

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